Sealing Shielding

New at electronica 2018: CHOFORM 5575 Form-In-Place EMI Gasket

Parker Chomerics CHOFORM 5575 Form-In-Place EMI GasketParker Chomerics is delighted to debut CHOFORM® 5575, an all-new form-in-place EMI gasket at electronica, the world's leading trade fair and conference for electronics. Located in Munich, Germany, electronica brings together nearly 80,000 visitors from 90 countries to discuss the industry’s latest market and technology topics.

What is CHOFORM 5575?

CHOFORM 5575 is a silver-plated aluminum filled, electrically conductive form-in-place gasket. Form-in-place gaskets are dispensed using an automated system and provide reliable electromagnetic interference (EMI) protection for packaged electronic assembles. They are ideal when isolation and complex cross section patterns are required, such as on automotive advanced driver-assistance systems (ADAS) modules or telecommunications boxes.

Good for high temperature, galvanic corrosion

CHOFORM 5575 brings exciting new technology, providing premier EMI shielding over a broad frequency range in high temperature environments up to 125° C (257° F).  CHOFORM 5575’s patented silver-plated aluminum filler technology allows for exceptional galvanic corrosion resistance when mated to an aluminum substrate, making this an ideal product for aluminum castings or airframes.

CHOFORM 5575 joins the family of Parker Chomerics CHOFORM dispensed form-in-place (FIP) EMI shielding gaskets, which are known to provide the lowest total cost of ownership for small cross section and complex pattern applications. From engine control modules (ECMs) to telecom infrastructure, to advanced avionic systems, CHOFORM is the designer’s first choice in form-in-place EMI gasket technology.

See it at electronica 2018

Be sure to visit Parker Chomerics at electronica, November 13-16, 2018 in Munich, Germany, in hall A2, stand 432 to see CHOFORM 5575, as well as the latest EMI shielding and thermal interface materials products from Parker Chomerics.



Jarrod Cohen



This blog was contributed by Jarrod Cohen, marketing communications manager, Parker Chomerics Division.




Related Content:

Top Three Design Tips for Corrosion Resistant EMI Protection

New Essential Handbook for EMI Shielding Applications

EMI Shielding Caulk Delivers Superior Performance in Military Radar Systems


Discover the CHOFORM Family of Form-In-Place EM Gaskets





Recent Posts by Author

How to Solve Large-Size Sealing Challenges at Temperatures up to 800 °C

When classic sealing materials – for instance in temperature ranges above 300°C and below -50°C – reach their limits alternative materials are required such as metal with appropriate coating/plating....

What to Know About O-Ring Cytotoxicity and the Pharmaceutical Industry

Most pharmaceutical manufacturers produce drugs in large vats of living cell cultures. For the production of these drugs, it is extremely important to ensure that these cell cultures are not exposed...

Five Things to Consider When Dispensing Form-In-Place EMI Gaskets and Thermal Gel

Automated form-in-place (FIP) dispensing of EMI shielding gaskets can be ideal for complicated patterns on electronics housings because automation allows for control over the size and shape of the...

Have a question about Parker products or services? We can help: Contact Us!

Comments for New at electronica 2018: CHOFORM 5575 Form-In-Place EMI Gasket

Please note that, in an effort to combat spam, comments with hyperlinks will not be published.

Leave a comment