Parker Chomerics THERM-A-GAP TC50 is the latest in the family of soft thermal conductive silicone elastomers developed to conduct heat between a hot component and a heatsink or enclosure. The heavy paste-like consistency of this one component putty can be easily dispensed in a controlled manner to produce different thicknesses in line with customer specific application requirements.
TC50 provides a low thermal impedance at multiple gaps to permit the deployment of commonly used spreaders. In addition, it only requires low compressive force to deform under assembly pressure. As a result, any stress on components, solder joints and leads is minimised.
This one component, RoHS compliant material is formulated to accommodate today’s high-performance electronics and is particularly suitable for volume markets due to ease-of-dispensing using robotics or automation, therefore reducing cycle times and costs considerably.
THERM-A-GAP TC50 is aimed at automotive ECUs (electronic control units), consumer electronics, power supplies and semiconductors, as well as microprocessors, memory and power modules. It can be packaged in syringes or cartridges, or bulk packaged in pails.
Delivering thermal conductivity of 5.5 W/m-K and heat capacity of 1 J/g-K, TC50 is typically suitable for all bond lines over 0.15 mm (0.006 in) thick.
THERM-A-GAP TC50 benefits include.
High thermal conductivity
Easy to handle / dispense
Ideal for high volume applications, such as those in the automotive industry
Can accommodate a variety of bond line applications
Watch our video of THERM-A-GAP TC50 thermal putty being dispensed below.
Learn more about Chomerics thermal interface materials for electronics cooling.
This blog was contributed by Melanie French, marketing communications manager, Parker Chomerics Division Europe.