As the defense industry continues to push the boundaries on
advanced electronic systems and state-of-the-art communication
devices, the requirements governing these programs must follow
On February 28, 2019
From the Parker O-Ring Handbook and Material Offering Guide to
finite element analysis and blogs, our engineering experts run the
gamut of all sealing solutions. So it's no surprise that the top
On February 27, 2019
Did you know that up to 80% of conductive coating failures can be
directly attributed to inadequate surface preparation? Not properly
preparing your surfaces for spraying or adherence is...
On February 14, 2019
The world of thermal interface materials continues to evolve as the
cooling requirements for applications in the automotive, consumer,
medical and aerospace markets continue to demand lower prices...
On February 7, 2019
Fundamental design checkpoints of new products generally focus
on the designs of mechanical, electrical and software systems. On
the whole, EMI/EMC design falls by the wayside for many...
On January 31, 2019
Wherever drinking water is obtained from any of its sources, pumped
and processed, materials with low extraction levels and without any
harmful ingredients are required. Sealing compounds for use
On January 29, 2019
There are a variety of thermal pads and gap fillers to choose from
-- so many choices that it can become so overwhelming. How can you
decide what's best for your application? And how does quality...
On January 24, 2019
Polyurethanes have been around for decades as a seal material for
high pressure reciprocating mobile hydraulic applications. Original
equipment manufacturers select it as their “go to” seal...
On January 22, 2019
2018 marked Parker's strongest year of financial performance in the
company's history (view Annual Report in "Related Posts" at the end
of the blog). Our focus on solving some of the world’s...
On January 15, 2019
Not long ago in hospitals and other critical care facilities, you
were greeted with a large, ominous warning sign the moment you
walked through the entrance doors to refrain from cell phone use
On January 15, 2019
You are working on a new design and want to incorporate the sealing
system directly – in 3D including a design space proposal? In
Parker Prädifa´s CAD library, 3D step files are available for you
On January 11, 2019
We’re rounding up the most popular posts of the year on the Parker
Chomerics EMI shielding blog in an effort to bid adieu to 2018 and
give you our most useful, popular content in one spot. Keep...
On December 26, 2018
As the days get shorter and fall gives way to winter, Jim Bradley
knows it’s time to reach for his trusty socket set and get to work.
The annual Bikes for Kids charity is nearly upon him, and...
On December 19, 2018
You’ve probably heard a bit about microwave absorbers and how they
are used to reduce or absorb the energy that is present in a
microwave. But what are they exactly? And how do they
work? Go ahead,...
On December 12, 2018
Mobile electronic devices such as smartphones and tablets require
highly populated printed circuit boards (PCBs) to support their
functionality and performance requirements in an...
On November 28, 2018
The future of electronics is smart, safe, and secure thanks to
technological advances in EMI shielding and thermal interface
materials found at electronica. Every two years in Munich,...
On November 20, 2018
Parker Chomerics is delighted to debut CHOFORM® 5575, an all-new
form-in-place EMI gasket at electronica, the world's leading trade
fair and conference for electronics. Located in Munich,...
On November 7, 2018
There are many electromagnetic interference (EMI) shielding
elastomer gasket mounting techniques that offer designers reliable,
cost-effective choices in both materials and component assembly.
On November 2, 2018
Pressure sensitive adhesive, more commonly known as PSA,
is adhesive which forms a bond when pressure is
applied, to join the adhesive with an EMI gasket. As the name
On October 25, 2018
Thermal Interface Materials (TIMs) are useful for thermal
management in electronic components, as they enhance heat transfer
from a heat-generating component to a heat dissipater, or heat
On October 16, 2018