A common question often asked by our customers is the reason why
flow rate is reported on datasheets of liquid-dispensed thermal
interface materials instead of viscosity. And it’s a fair...
On July 17, 2019
Conductive elastomer EMI shielding gaskets use metallic particles
to create a conductive path and shield enclosures from
electromagnetic radiation. A key measurement of these gaskets is
On June 5, 2019
Want to know how we partnered with customers to increase
productivity and profitability through engineering innovation? The
Parker Hannifin stand experienced a busy and successful week at
On May 16, 2019
Galvanic corrosion (also known as bimetallic corrosion or
dissimilar metal corrosion) is the breakdown of metallic surfaces
as a result of the difference in electrical potential of adjacent
On April 24, 2019
EMI shielding gaskets such as conductive elastomer gaskets come in
many different materials and almost a limitless number of shapes
and sizes. They are most commonly made of a base material...
On April 18, 2019
For more than 100 years, the car has simply been used as a device
for transporting a driver and passengers from point A to point B at
speed with minimum effort. With the introduction of
On March 19, 2019
Honeycomb air ventilation panels are used in applications where
superior electromagnetic interference (EMI) shielding must be
incorporated with heat dissipation in the form of airflow. Every
On March 14, 2019
As the defense industry continues to push the boundaries on
advanced electronic systems and state-of-the-art communication
devices, the requirements governing these programs must follow
On February 28, 2019
Did you know that up to 80% of conductive coating failures can be
directly attributed to inadequate surface preparation? Not properly
preparing your surfaces for spraying or adherence is...
On February 14, 2019
The world of thermal interface materials continues to evolve as the
cooling requirements for applications in the automotive, consumer,
medical and aerospace markets continue to demand lower prices...
On February 7, 2019
Fundamental design checkpoints of new products generally focus
on the designs of mechanical, electrical and software systems. On
the whole, EMI/EMC design falls by the wayside for many...
On January 31, 2019
There are a variety of thermal pads and gap fillers to choose from
-- so many choices that it can become so overwhelming. How can you
decide what's best for your application? And how does quality...
On January 24, 2019
Not long ago in hospitals and other critical care facilities, you
were greeted with a large, ominous warning sign the moment you
walked through the entrance doors to refrain from cell phone use
On January 15, 2019
We’re rounding up the most popular posts of the year on the Parker
Chomerics EMI shielding blog in an effort to bid adieu to 2018 and
give you our most useful, popular content in one spot. Keep...
On December 26, 2018
As the days get shorter and fall gives way to winter, Jim Bradley
knows it’s time to reach for his trusty socket set and get to work.
The annual Bikes for Kids charity is nearly upon him, and...
On December 19, 2018
The future of electronics is smart, safe, and secure thanks to
technological advances in EMI shielding and thermal interface
materials found at electronica. Every two years in Munich,...
On November 20, 2018
Thermal Interface Materials (TIMs) are useful for thermal
management in electronic components, as they enhance heat transfer
from a heat-generating component to a heat dissipater, or heat
On October 16, 2018
Every fall just outside of Detroit, MI, thousands of electric and
hybrid vehicle industry insiders descend onto the Electric &
Hybrid Vehicle Technology Expo in Novi, MI. Delivering the...
On September 17, 2018
We’re thrilled to announce the Chomerics Division of Parker
Hannifin Corporation, the global leader in motion and control
technologies, has received the prestigious Q1 certification from
On July 26, 2018
Parker Chomerics THERM-A-GAP TC50 is the latest in the family
of soft thermal conductive silicone elastomers developed to conduct
heat between a hot component and a heatsink or enclosure. The...
On February 13, 2018