Parker Chomerics is delighted to debut CHOFORM® 5575, an all-new form-in-place EMI gasket at electronica, the world's leading trade fair and conference for electronics. Located in Munich, Germany, electronica brings together nearly 80,000 visitors from 90 countries to discuss the industry’s latest market and technology topics.
CHOFORM 5575 is a silver-plated aluminum filled, electrically conductive form-in-place gasket. Form-in-place gaskets are dispensed using an automated system and provide reliable electromagnetic interference (EMI) protection for packaged electronic assembles. They are ideal when isolation and complex cross section patterns are required, such as on automotive advanced driver-assistance systems (ADAS) modules or telecommunications boxes.
CHOFORM 5575 brings exciting new technology, providing premier EMI shielding over a broad frequency range in high temperature environments up to 125° C (257° F). CHOFORM 5575’s patented silver-plated aluminum filler technology allows for exceptional galvanic corrosion resistance when mated to an aluminum substrate, making this an ideal product for aluminum castings or airframes.
CHOFORM 5575 joins the family of Parker Chomerics CHOFORM dispensed form-in-place (FIP) EMI shielding gaskets, which are known to provide the lowest total cost of ownership for small cross section and complex pattern applications. From engine control modules (ECMs) to telecom infrastructure, to advanced avionic systems, CHOFORM is the designer’s first choice in form-in-place EMI gasket technology.
Be sure to visit Parker Chomerics at electronica, November 13-16, 2018 in Munich, Germany, in hall A2, stand 432 to see CHOFORM 5575, as well as the latest EMI shielding and thermal interface materials products from Parker Chomerics.
This blog was contributed by Jarrod Cohen, marketing communications manager, Parker Chomerics Division.