Parker Chomerics has recently released THERM-A-GAP™ GEL 75, a 7.5 W/m-K thermal conductivity, single-component, dispensable thermal interface material. THERM-A-GAP GEL 75 is the latest from the THERM-A-GAP family of dispensable thermal materials from Parker Chomerics to be released to the market.
When applied to a heat-generating component, THERM-A-GAP GEL 75 provides minimal stress and pressure due to its low compression force. It is form stable in horizontal or vertical applications and allows for lower assembly costs when compared to multiple thermal gap pads in higher volume applications.
THERM-A-GAP GEL 75 represents the highest thermal conductivity dispensable available from Parker Chomerics. With a flow rate of 30 grams per second, it is nearly 3x faster than the next closest performing material in the THERM-A-GAP family.
The gel-like consistency enables superior performance and long-term thermal stability and is designed to be dispensed in applications requiring low compressive forces and minimal thermal resistance for maximal thermal performance.
Parker Chomerics has conducted a detailed examination of the thermal reliability of this high-performance gap filler after being subjected to long-term environmental aging under dry heat, heat and humidity conditions, and temperature cycling from -40°C to 125°C.
The thermal performance of THERM-A-GAP GEL 75 was examined, and the findings were reported in the THERM-A-GAP GEL 75 Reliability Report TR1104. After being subjected to multiple environmental stress tests, the thermal impedance of the aged samples did not experience a significant increase after any of the treatments studied.
After a 1,000-hour dwell at 125°C, 1,000 hours at 85°C/85% relative humidity, and 1,000 temperature cycles from -40°C to 125°C, there was no statistically significant increase in impedance according to one-way ANOVA with the Tukey method for multiple comparisons.
The National Aeronautics and Space Administration (NASA) criteria for low-volatility materials limits the total mass loss (TML) to 1.0% and collected volatile condensable material (CVCM) to 0.10%. Outgassing results for GEL 75 are 0.18% TML and 0.05% CVCM. Independent laboratory results indicate THERM-A-GAP GEL 75 passes the NASA outgassing criteria for low-volatility material.
Based on these results, THERM-A-GAP GEL 75 demonstrates the ability to withstand long-term aging without a reduction in thermal performance. THERM-A-GAP GEL 75 is best suited for high volume, automated production, specifically found in telecommunication applications, base stations, power supplies, and memory and power modules.
Learn more about THERM-A-GAP GEL 75 and receive a free product sample.
This blog post was contributed by Jarrod Cohen, marketing communications for Parker Chomerics.